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Dynamic response of electronic materials to impact loading: review
Author(s) -
Suhir E.,
Ghaffarian R.
Publication year - 2017
Publication title -
zamm ‐ journal of applied mathematics and mechanics / zeitschrift für angewandte mathematik und mechanik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.449
H-Index - 51
eISSN - 1521-4001
pISSN - 0044-2267
DOI - 10.1002/zamm.201600064
Subject(s) - drop impact , soldering , joint (building) , vibration , dynamic loading , drop (telecommunication) , computer science , materials science , structural engineering , engineering , mechanical engineering , composite material , acoustics , physics , splash
In this review we consider publications addressing the dynamic response of electronic materials to shocks and vibrations. The emphasis is on the second level solder joint interconnections (package‐to‐substrate) and on the board‐level drop testing.