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Analysis of a pre‐stressed bi‐material accelerated‐life‐test (ALT) specimen
Author(s) -
Suhir E.
Publication year - 2011
Publication title -
zamm ‐ journal of applied mathematics and mechanics / zeitschrift für angewandte mathematik und mechanik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.449
H-Index - 51
eISSN - 1521-4001
pISSN - 0044-2267
DOI - 10.1002/zamm.201000101
Subject(s) - thermostat , compression (physics) , materials science , structural engineering , component (thermodynamics) , microelectromechanical systems , mode (computer interface) , mechanical engineering , computer science , composite material , engineering , physics , optoelectronics , thermodynamics , operating system
Abstract Application of mechanical pre‐stressing could be an effective means for achieving a failure‐mode‐shift‐free “destructive ALT effect” in electronic and photonic devices and micro‐electro‐mechanical systems (MEMS). A simple, physically meaningful and easy‐to‐use analytical (“mathematical”) predictive model has been developed to assess the magnitude and the distribution of stresses in a bi‐material assembly subjected to the combined action of thermally induced (considered by the ALT design) and external (“mechanical”) pre‐stressing. Such a compressive pre‐stressing is applied to the assembly component that is expected to experience thermal compression. The model is an extension and a modification of the author's 1986 and 1989 “bi‐metal thermostat” models suggested as a generalization of the 1925 Timoshenko's theory.