Premium
Chemical Bonding in Zinc‐based Intermetallic Compounds with the CuTi or the CsCl Type of Structure
Author(s) -
Alarcón Villaseca Sebastián,
Kandaskalov Dmytro,
Gaudry Émilie,
Armbrüster Marc
Publication year - 2014
Publication title -
zeitschrift für anorganische und allgemeine chemie
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.354
H-Index - 66
eISSN - 1521-3749
pISSN - 0044-2313
DOI - 10.1002/zaac.201300583
Subject(s) - intermetallic , tetragonal crystal system , electronegativity , materials science , ionic bonding , zinc , chemical bond , crystallography , chemical physics , chemistry , ion , crystal structure , metallurgy , alloy , organic chemistry
The chemical bonding in the intermetallic compounds ZnPd and ZnPt with the tetragonal CuTi type of structure, and in the chemically related intermetallic compounds ZnNi, ZnCu, ZnAg, and ZnAu with the cubic CsCl type of structure, is examined applying the electron localizability approach. The analysis of the chemical bonding reveals charge transfer from zinc to the transition metal ( TM ), in line with the respective electronegativities. While in ZnNi, ZnCu, and ZnAg as well as ZnPd and ZnPt the Zn– TM interactions are described by multi‐center bonding and ionic interactions, mainly ionic interactions are found in the intermetallic compound ZnAu. Going from ZnNi over ZnPd to ZnPt, a gradual change from isotropic to more and more anisotropic distribution of the atomic interactions is detected, resulting in a more pronounced tetragonal distortion.