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Stability of thermoresponsive methylcellulose thin film: x‐ray reflectivity study
Author(s) -
InnisSamson Vallerie Ann,
Sakurai Kenji
Publication year - 2009
Publication title -
x‐ray spectrometry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.447
H-Index - 45
eISSN - 1097-4539
pISSN - 0049-8246
DOI - 10.1002/xrs.1182
Subject(s) - x ray reflectivity , thin film , materials science , wetting , surface finish , substrate (aquarium) , thermal stability , polymer , surface roughness , silicon , quenching (fluorescence) , analytical chemistry (journal) , composite material , optics , chemical engineering , optoelectronics , nanotechnology , chemistry , organic chemistry , oceanography , physics , geology , engineering , fluorescence
Methylcellulose (MC), a thermoreversible polymer, was fabricated as thin films into silicon substrates and characterized by x‐ray reflectivity (XRR) measurements for its stability with time and heating. XRR data from the as‐is thin films showed good agreement with the single‐layer model on top of a substrate from Parratt's formalism. Data fitting showed that the density of the thin films is slightly higher than the reported value by manufacturers. Interface roughness values indicate good wetting of the polymer onto the substrate. Heating the thin films at the phase transition temperatures and quenching them to room temperature showed no significant changes in the thin film parameters before and after heating. This showed the thermal stability and/or thermoreversibility of the film. Diffuse scattering measurements also showed no significant changes in the lateral structure of the film with heating and quenching. XRR measurements done on fabricated thin films stored for a month showed a slight increase in the film thickness which could be due to the hygroscopic nature of the polymer. Vacuum heating of the stored thin films at 100 °C for 1 h slightly decreased the thickness, but it has been found that other parameters such as density and surface/interface roughness show good thermal stability. Copyright © 2009 John Wiley & Sons, Ltd.