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Model simulation of radio frequency heatseal performance of flexible PVC and other materials
Author(s) -
Ling Michael T. K.,
Westphal Stanley,
Woo Lecon
Publication year - 1992
Publication title -
journal of vinyl technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 35
eISSN - 1548-0585
pISSN - 0193-7197
DOI - 10.1002/vnl.730140405
Subject(s) - plasticizer , materials science , rheology , thermal conductivity , composite material , thermal , radio frequency , polymer , ethylene vinyl acetate , dielectric , frequency dependence , thermodynamics , computer science , telecommunications , optoelectronics , physics , nuclear magnetic resonance , copolymer
Despite the long history of the application of radio frequency energies for the joining and assembly of polymer films and articles, a comprehensive, quantitative understanding of all the factors has been lacking. In this article, a quantitative first principle type study is described for flexible PVC of various plasticizer contents and ethylene vinyl acetate (EVA) of different VA compositions. High frequency dielectric data of up to 10 MHz were collected over broad temperature ranges. Separate thermal properties of specific heat and thermal conductivity were determined. In addition, rheological functions over required temperatures and shear rates were applied. Comparisons of predicted heatseal behavior with experimental observations are presented.