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Role of nano‐size SiO 2 additive on the thermal behavior of cyanoacrylate nanocomposite
Author(s) -
Yaghmaei Amir,
Torbati Mehrdad Kashefi,
Zebarjad Seyyed Mojtaba
Publication year - 2010
Publication title -
journal of vinyl and additive technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 35
eISSN - 1548-0585
pISSN - 1083-5601
DOI - 10.1002/vnl.20236
Subject(s) - cyanoacrylate , thermogravimetric analysis , differential scanning calorimetry , materials science , nanocomposite , composite material , nano , adhesive , polymerization , thermal analysis , chemical engineering , polymer chemistry , thermal , polymer , physics , layer (electronics) , meteorology , engineering , thermodynamics
Nowadays, solvent‐free, one‐part cyanoacrylate adhesive is widely used in medicine and dentistry. According to a literature survey done by the authors, there are few papers concentrated on the role of nano‐sized particles on the thermal behavior of cyanoacrylate glue. Thus the main goal of the current research focused on clarifying the role of nano‐sized SiO 2 on the thermal behavior of cyanoacrylate. Thermal behavior of all materials including cyanoacrylate and its nanocomposites was studied by using Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) methods. The results of DSC analysis showed that an increase in the amount of nano‐sized SiO 2 results in decreases in the duration of cyanoacrylate curing, energy release during polymerization, and incubation time of polymerization. Furthermore, the results of TGA tests illustrated that the weight loss of cyanoacrylate strongly depends on the contents of both caffeine and SiO 2 . In fact, an increase in nano‐sized SiO 2 content increases the degradation temperature of cyanoacrylate. J. VINYL ADDIT. TECHNOL., 2010. © 2010 Society of Plastics Engineers