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Characterization and properties of polyphthalamide/polyamide blends and polyphthalamide/polyamide/polyolefin blends
Author(s) -
Desio Glenn P.
Publication year - 1996
Publication title -
journal of vinyl and additive technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 35
eISSN - 1548-0585
pISSN - 1083-5601
DOI - 10.1002/vnl.10131
Subject(s) - materials science , polyolefin , miscibility , polyamide , glass transition , composite material , dynamic mechanical analysis , polymer blend , dynamic modulus , melting point , heat deflection temperature , characterization (materials science) , modulus , polymer , izod impact strength test , ultimate tensile strength , copolymer , layer (electronics) , nanotechnology
Polyphthalamide(PPA)/polyamide(PA) blends were analyzed to determine the effect of PA addition to PPA on melting point, glass transition temperature, dynamic modulus, and heat distortion temperature. Results indicate that the choice of PPA and the choice of PA for the blend systems affects not only the above properties but also the miscibility of the blend systems. In general, PA addition to PPA lowers the melting point and glass transition, which potentially makes these blend materials easier to process. Also, the PPA/PA blends were observed to have dynamic modulus curves with transitions shifted to lower temperatures and crystalline plateaus shifted to lower modulus. PPA/PA/polyolefin(PP) systems were investigated to determine if a useful balance of properties could be obtained, even though the blend components would have to be processed at unusually high processing temperatures (in excess of 320°C). Morphological characterization indicates that small dispersed domains of PP are obtained. The modifiers utilized in these systems were either found at the interface of the PP domain or dispersed within the PP domain. The properties of PPA/PA/PP blends indicates that these systems are ductile and have a good balance of strength, stiffness, impact, and thermal performance.