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Effect of stabilizing and brightening agents and some operated conditions on electroplating kinetics of NiCu alloys from citrate‐sulfate solutions
Author(s) -
Van Vy Uong,
Thang Le Ba,
Huong Nguyen Thi Thanh,
Que Le Xuan
Publication year - 2021
Publication title -
vietnam journal of chemistry
Language(s) - English
Resource type - Journals
eISSN - 2572-8288
pISSN - 0866-7144
DOI - 10.1002/vjch.202000094
Subject(s) - kinetics , sulfate , chemistry , electroplating , chemical engineering , nuclear chemistry , organic chemistry , physics , layer (electronics) , quantum mechanics , engineering
Abstract The effect of stabilizing and brightening additives, temperature and stirring on electrodeposited kinetics of NiCu alloy has been studied by the linear polarization method. The additives almost do not affect on the electrochemical reduction rate of Cu 2+ ions, however it has a much affect on the reduction rate of Ni 2+ ions. The presence of boric acids, saccharin or 1,4‐butynediol have increased cathode polarization, inhibited precipitation alloy and shifted discharge potential of Ni 2+ about 100 to 150 mV towards more negative. The solution temperature strongly affected on the polarization curve over the full range of investigated electrode potential, the cathode current increased about 1.5 times when the temperature increases from 30 to 50 o C. The stirring did not increase the discharge current of Ni 2+ ions, on the contrary, it significantly increased the discharge current of Cu 2+ ions, increasing from 2 to 3 times compared to when did not stir.