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PECVD TM Coatings in Industrial Applications
Author(s) -
Seaman Walter,
Madocks John,
Jochum Toni
Publication year - 2012
Publication title -
vakuum in forschung und praxis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.213
H-Index - 13
eISSN - 1522-2454
pISSN - 0947-076X
DOI - 10.1002/vipr.201200485
Subject(s) - plasma enhanced chemical vapor deposition , sputtering , nitride , materials science , thin film , layer (electronics) , silicon nitride , nanotechnology
The adoption of GPI's Linear PECVD TM process has accelerated over the last year. Several R&D and production reactor modules were installed at major companies and a turnkey in‐line system was completed. Through these installations, customers are confirming the superior deposition rate, uniformity and stability of Linear PECVD TM compared to reactive sputtering. Today Linear PECVD TM is being used to deposit oxide and nitride films on a variety of substrates. The films include SiO 2 , TiO 2 , Al2 2 O 3 , SiN, ZnO, and SnO and the applications include multi‐layer AR coatings, single layer oxides and nitrides in combination with sputtered films, thin‐film solar coatings, barrier films, anti‐smudge coatings and TCO's. This progress demonstrates that GPI's Linear PECVD TM technology may soon displace reactive sputtering of oxides and nitrides for large area substrates in architectural glass, flat panel display and flexible web applications.