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Potenzen des Puls‐Magnetron‐Sputterns (PMS)
Author(s) -
Schiller S.,
Goedicke K.,
Kirchhoff V.,
Metzner Ch.
Publication year - 1995
Publication title -
vakuum in forschung und praxis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.213
H-Index - 13
eISSN - 1522-2454
pISSN - 0947-076X
DOI - 10.1002/vipr.19950070409
Subject(s) - plasma , sputtering , coating , materials science , electrode , optoelectronics , sputter deposition , substrate (aquarium) , pulsed dc , deposition (geology) , thin film , nanotechnology , chemistry , paleontology , physics , oceanography , quantum mechanics , sediment , geology , biology
Up to now, a pulsed plasma with pulse rates between 50 and 150 kHz has been used in PVD techniques only rarely. Recently, our activities and the efforts of various other research teams were concentrated on this field. The MF‐pulsed plasma offers facility to overcome limitations that restrict the use of DC and RF sputtering. A high motivation for further development results from the objective to coat large areas, to attain the highest possible deposition rates and to carry out a considerate plasma‐assisted surface treatment or plasma coating matched to the compatibility of the substrates. Via pulsed sputtering and plasma‐activated deposition, the application of a pulsed plasma goes from tasks of substrate pretreatment and etching to the plasma‐assisted surface treatment of layers or workpieces. Unipolar pulsed electrodes — in particular floating‐powered multi‐electrode arrangements — pave the way to stable long‐term and arc‐free reactive deposition of defect‐free and electrically insulating layers. The pulsed plasma also opens up fresh ground in the use of bias effects for the deposition of poorly conducting layers and for the coating of thin insulating substrates on an industrial scale.