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Prozesse mit hoher Plasmastromdichte und unterschiedlichen Verdampfungsquellen
Author(s) -
Bergmann Erich
Publication year - 1993
Publication title -
vakuum in forschung und praxis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.213
H-Index - 13
eISSN - 1522-2454
pISSN - 0947-076X
DOI - 10.1002/vipr.19930050308
Subject(s) - triode , deposition (geology) , plasma , coating , current density , materials science , substrate (aquarium) , current (fluid) , cavity magnetron , optoelectronics , chemistry , electrical engineering , voltage , sputtering , nanotechnology , thin film , engineering , physics , capacitor , nuclear physics , paleontology , oceanography , quantum mechanics , sediment , geology , biology
The hot filament supported high current discharge can be used with various process steps. During the heating cycle, intense electron bombardment provides a soft and efficient energy source. In triode etching the high plasma density improves the throwing power and reduces the arcing problem on oxide inclusions from preceding grinding steps. For the coating cycle the high current density can be fitted into different deposition processes. Activated reactive ion plating is done with a high voltage electron beam gun. But one can also combine the high current density plasma with a magnetron to produce a high plasma density on the substrate and solve the problems of reactivity of this vapor source. Alternatively the high current density plasma can also be used to drive a CVD‐reaction. Several of these processes can be combined to hybrid deposition technologies. A few examples of coating realisations and performance in the different processes will be given.