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Biodegradable polymer scaffold, semi‐solid solder, and single‐spot lasing for increasing solder‐tissue bonding in suture‐free laser‐assisted vascular repair
Author(s) -
Pabittei Dara R.,
Heger Michal,
Simonet Marc,
Tuijl Sjoerd,
Wal Allard C.,
Beek Johan F.,
Balm Ron,
Mol Bas A.
Publication year - 2012
Publication title -
journal of tissue engineering and regenerative medicine
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.835
H-Index - 72
eISSN - 1932-7005
pISSN - 1932-6254
DOI - 10.1002/term.486
Subject(s) - soldering , materials science , laser , fibrous joint , scaffold , lasing threshold , biomedical engineering , optoelectronics , composite material , optics , surgery , engineering , medicine , wavelength , physics
We recently showed the fortifying effect of poly‐caprolactone (PCL) scaffold in liquid solder‐mediated laser‐assisted vascular repair (ssLAVR) of porcine carotid arteries, yielding a mean ± SD leaking point pressure of 488 ± 111 mmHg. Despite supraphysiological pressures, the frequency of adhesive failures was indicative of weak bonding at the solder‐tissue interface. As a result, this study aimed to improve adhesive bonding by using a semi‐solid solder and single‐spot vs . scanning irradiation. In the first experiment, in vitro ssLAVR (n = 30) was performed on porcine abdominal aorta strips using a PCL scaffold with a liquid or semi‐solid solder and a 670‐nm diode laser for dual‐pass scanning. In the second experiment, the scanning method was compared to single‐spot lasing. The third experiment investigated the stability of the welds following hydration under quasi‐physiological conditions. The welding strength was defined by acute breaking strength (BS). Solder‐tissue bonding was examined by scanning electron microscopy and histological analysis was performed for thermal damage analysis. Altering solder viscosity from liquid to semi‐solid solder increased the BS from 78 ± 22 N/cm 2 to 131 ± 38 N/cm 2 . Compared to scanning ssLAVR, single‐spot lasing improved adhesive bonding to a BS of 257 ± 62 N/cm 2 and showed fewer structural defects at the solder‐tissue interface but more pronounced thermal damage. The improvement in adhesive bonding was associated with constantly stronger welds during two weeks of hydration. Semi‐solid solder and single‐spot lasing increased welding strength by reducing solder leakage and improving adhesive bonding, respectively. The improvement in adhesive bonding was associated with enhanced weld stability during hydration. Copyright © 2011 John Wiley & Sons, Ltd.