Development of Thermal Conductive  tpPI /Oriented  h‐BN  Insulating Composite Material Using the Electrostatic Adsorption Method | Zendy

Murakami Yoshinobu | Zendy; Hamasaki Norikazu | Zendy; Kikuike Akio | Zendy; Kawashima Tomohiro | Zendy; Hozumi Naohiro | Zendy

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Development of Thermal Conductive tpPI /Oriented h‐BN Insulating Composite Material Using the Electrostatic Adsorption Method

Author(s) -

Murakami Yoshinobu,

Hamasaki Norikazu,

Kikuike Akio,

Kawashima Tomohiro,

Hozumi Naohiro

Publication year - 2020

Publication title -

ieej transactions on electrical and electronic engineering

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.254

H-Index - 30

eISSN - 1931-4981

pISSN - 1931-4973

DOI - 10.1002/tee.23228

Subject(s) - materials science , composite material , thermal stability , thermal conductivity , composite number , boron nitride , electrical conductor , flexural strength , thermal , adsorption , chemical engineering , chemistry , physics , meteorology , engineering , organic chemistry

A thermal conductive plate in a device like a power module for an automobile requires materials with high thermal conductivity, acceptable electric breakdown strength, and high thermal stability. Thermoplastic polyimide (tpPI)/oriented hexagonal boron nitride (h‐BN) composite materials are produced by an electrostatic adsorption method. The tpPI/oriented h‐BN composite shows high thermal properties (glass transition temperature of about 240 °C and a thermal conductivity of 10 W/mK or more, so on.) In addition, the direct current breakdown strength exceeds 150 kV/mm. It is cleared that the tpPI/oriented h‐BN composite exhibits an acceptable breakdown strength, high thermal conductivity, and high thermal stability. © 2020 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.

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