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Development of Thermal Conductive tpPI /Oriented h‐BN Insulating Composite Material Using the Electrostatic Adsorption Method
Author(s) -
Murakami Yoshinobu,
Hamasaki Norikazu,
Kikuike Akio,
Kawashima Tomohiro,
Hozumi Naohiro
Publication year - 2020
Publication title -
ieej transactions on electrical and electronic engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.254
H-Index - 30
eISSN - 1931-4981
pISSN - 1931-4973
DOI - 10.1002/tee.23228
Subject(s) - materials science , composite material , thermal stability , thermal conductivity , composite number , boron nitride , electrical conductor , flexural strength , thermal , adsorption , chemical engineering , chemistry , physics , meteorology , engineering , organic chemistry
A thermal conductive plate in a device like a power module for an automobile requires materials with high thermal conductivity, acceptable electric breakdown strength, and high thermal stability. Thermoplastic polyimide (tpPI)/oriented hexagonal boron nitride (h‐BN) composite materials are produced by an electrostatic adsorption method. The tpPI/oriented h‐BN composite shows high thermal properties (glass transition temperature of about 240 °C and a thermal conductivity of 10 W/mK or more, so on.) In addition, the direct current breakdown strength exceeds 150 kV/mm. It is cleared that the tpPI/oriented h‐BN composite exhibits an acceptable breakdown strength, high thermal conductivity, and high thermal stability. © 2020 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.