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Simulation of temperature field of basin insulator and optimization of oven structure
Author(s) -
Kan Chaohao,
Ruan Zhiwei,
Yuan Duanpeng,
Hao Liucheng
Publication year - 2020
Publication title -
ieej transactions on electrical and electronic engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.254
H-Index - 30
eISSN - 1931-4981
pISSN - 1931-4973
DOI - 10.1002/tee.23078
Subject(s) - insulator (electricity) , curing (chemistry) , materials science , composite material , structural basin , mechanical engineering , engineering , geology , paleontology
Due to the 'filler' effect, the pot insulators need to be solidified from bottom to top during the curing process, which requires the epoxy to have a reasonable temperature gradient during curing. To improve the curing quality of the basin insulator in the oven, this study uses the SolidWorks modeling software to establish the physical model and simulates the whole process of the curing process of the ultra high voltage (UHV) basin insulator by computer simulation technology and the finite element principle. For the case in which the temperature difference between the concave side and the convex side of the section of the basin insulator is too large during the curing process, the existing oven structure is improved, and the temperature difference between the concave side and the convex side of the front and rear basin insulator sections is compared. The simulation results show that the optimized oven structure has a better temperature field distribution of the basin insulator during the curing process. The correctness of the simulation was verified by testing the temperature and strain during the curing process of the basin insulator. Compared with the old oven, the new oven structure reduces strain on the insulator during curing by about 10%, indicating the superiority of the new oven. © 2019 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.