z-logo
Premium
SF 6 decomposition components under different metallic free‐conducting wire‐type particles in positive DC partial discharge
Author(s) -
Cao Zhengqin,
Tang Ju,
Zhou Yongjian,
Zeng Fuping
Publication year - 2019
Publication title -
ieej transactions on electrical and electronic engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.254
H-Index - 30
eISSN - 1931-4981
pISSN - 1931-4973
DOI - 10.1002/tee.22799
Subject(s) - partial discharge , decomposition , metal , materials science , analytical chemistry (journal) , aluminium , mass spectrometry , chemistry , metallurgy , electrical engineering , voltage , engineering , chromatography , organic chemistry
This study aimed to explore the common free‐conducting wire‐type particles that can produce severe partial discharge (PD) in DC gas‐insulated equipment. The experiment was conducted on the SF 6 positive DC PD experimental system to determine the influence of the free‐conducting wire‐type particles of three kinds of metal materials (aluminum, 18/8 stainless steel, and copper) on SF 6 decomposition. The change rules of five main characteristic decomposition components, namely, CF 4 , CO 2 , SOF 2 , SO 2 F 2 , and SO 2 , under different free‐conducting metal particles were obtained using gas chromatography–mass spectrometry quantitative detection. No significant correlation was observed between the formation of CO 2 and the kinds of metal materials; however, the kinds of metal materials significantly influenced the formation of the other four kinds of characteristic gases. The differences in the physical and chemical properties of the metal materials caused the different characteristics of SF 6 positive DC PD decomposition under different free‐conducting metal wire‐type particles. Findings provide an experimental basis for the diagnosis of fault‐type positive DC SF 6 gas‐insulated equipment. © 2018 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here