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Reliability analysis of the sealed relay based on degradation data
Author(s) -
Li Wenhua,
Zhou Lulu,
Lu Weide
Publication year - 2018
Publication title -
ieej transactions on electrical and electronic engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.254
H-Index - 30
eISSN - 1931-4981
pISSN - 1931-4973
DOI - 10.1002/tee.22576
Subject(s) - reliability (semiconductor) , reliability engineering , relay , drop test , degradation (telecommunications) , sample (material) , computer science , materials science , engineering , electronic engineering , structural engineering , thermodynamics , power (physics) , physics
The reliability analysis method for a sealed relay based on degradation data is presented. Based on the accelerated life storage test, the degradation data of the contact pressure drop parameter of 25 sealed relays at 125 °C temperature are selected as the sample. Considering the physical meaning of parameter degradation, the one‐dimensional parameters are fused into comprehensive, data‐integrated, multidimensional parameters by factor analysis and typical correlation analysis. The pseudo‐life of 25 relay samples is obtained when the failure threshold of the contact pressure drop is converted into the equivalent value through the coefficient weight of each sample. Reliability analysis of the contact is analyzed by verifying that the pseudo‐life matches with the normal distribution. Finally, the storage reliability of the product changes gently with time when the conditions of the accelerated test are certain. This method provides a good perspective for reliability analysis. © 2017 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.