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Fabrication of densely arrayed Si needles with large height for transdermal drug delivery system application
Author(s) -
Sasaki Hikaru,
Shikida Mitsuhiro,
Sato Kazuo
Publication year - 2007
Publication title -
ieej transactions on electrical and electronic engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.254
H-Index - 30
eISSN - 1931-4981
pISSN - 1931-4973
DOI - 10.1002/tee.20148
Subject(s) - transdermal , fabrication , materials science , etching (microfabrication) , drug delivery , nanotechnology , optoelectronics , composite material , medicine , alternative medicine , layer (electronics) , pathology , pharmacology
The effects of varying etching conditions for microneedle fabrication were investigated in order to form densely arrayed, sharply angled Si needles with large height for application in transdermal drug delivery systems (DDSs). A sharply angled needle shape could be fabricated by using 34.0 wt% KOH (representing a typical etching‐rate diagram at a highly alkaline etching solution concentration). The needle height could be increased by 20% by adding a compensation mask pattern or by increasing the KOH concentration to 51.0 wt%. The trade‐off relationship between the maximum needle height and the needle density was calculated. These experiments provided useful parameters for designing densely arrayed, sharply angled Si needles for transdermal DDS application. Copyright © 2007 Institute of Electrical Engineers of Japan© 2007 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.