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Cover Picture: Structural Engineering of Semiconductor Nanoparticles by Conjugated Interfacial Bonds (Chem. Rec. 1/2020)
Author(s) -
Peng Yi,
Liu Qiming,
Chen Shaowei
Publication year - 2020
Publication title -
the chemical record
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 1.61
H-Index - 78
eISSN - 1528-0691
pISSN - 1527-8999
DOI - 10.1002/tcr.202080101
Subject(s) - conjugated system , nanoparticle , delocalized electron , semiconductor , chemical physics , nanotechnology , cover (algebra) , materials science , charge (physics) , particle (ecology) , chemistry , organic chemistry , polymer , optoelectronics , mechanical engineering , engineering , physics , oceanography , quantum mechanics , geology
The cover picture shows the significance of interfacial bonding contact in manipulating the optical and electronic properties of semiconductor nanoparticles. Specifically, when the nanoparticles are functionalized with conjugated interfacial bonds, intraparticle charge delocalization occurs between the particle‐bound functional moieties under select photoirradiation (“on” state). Such intraparticle charge transfer is impeded with a saturated interfacial linkage (“off” state). See the Personal Account by S. Chen et al. (DOI: 10.1002/tcr.201900010).