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Gaussian process modeling for engineered surfaces with applications to Si wafer production
Author(s) -
Plumlee Matthew,
Jin Ran,
Roshan Joseph V.,
Shi Jianjun
Publication year - 2013
Publication title -
stat
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 18
ISSN - 2049-1573
DOI - 10.1002/sta4.26
Subject(s) - wafer , gaussian process , process (computing) , gaussian , stochastic process , computer science , stochastic modelling , quality (philosophy) , statistical process control , process engineering , materials science , mathematical optimization , engineering , mathematics , nanotechnology , statistics , physics , quantum mechanics , operating system
When producing engineered surfaces, the stochastic portion of the processing greatly affects the overall output quality. We propose a Gaussian process model that accounts for the impact of control variables on the stochastic elements of the produced surfaces. An optimization algorithm is outlined to find the maximum likelihood estimates of the model parameters. A case study involving the thickness surfaces of semiconductor wafers is examined that demonstrates the need for the proposed approach. Copyright © 2013 John Wiley & Sons Ltd