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CIGS Mini‐Modules with Dispensed Metallization on Transparent Conductive Oxide Layer
Author(s) -
Gensowski Katharina,
Jimenez Ana,
Freund Timo,
Wengenmeyr Noah,
Tepner Sebastian,
Pospischil Maximilian,
Clement Florian
Publication year - 2020
Publication title -
solar rrl
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.544
H-Index - 37
ISSN - 2367-198X
DOI - 10.1002/solr.202000475
Subject(s) - copper indium gallium selenide solar cells , materials science , electrical conductor , screen printing , optoelectronics , electrical resistivity and conductivity , metal , oxide , layer (electronics) , solar cell , composite material , metallurgy , electrical engineering , engineering
This article presents the application of a parallel dispensing device for low‐temperature silver paste metallization on transparent conductive oxide (TCO) layers of Cu(In 1 − x Ga x )Se 2 (CIGS) substrates as an alternative metallization technology to screen printing and inkjet printing. A curing variation experiment is performed to analyze the effect of different curing conditions on the resulting contact resistivity of the metal grid. Contact resistivity values below 5 mΩcm 2 are achieved. Furthermore, CIGS mini‐modules are metallized with three different low‐temperature paste formulations obtaining a record core finger geometry of 25 μm and an average optical aspect ratio of 0.46 using 25 μm nozzle openings. The dispensed metal grid on the TCO layers achieves the comparable current density values of j sc = 32.2 mA cm − 2 and the open‐circuit voltages values per cell of V oc = 672 mV as the screen printed metal grid on CIGS mini‐modules and, hence, a nominal power of 2.05 W. The metal grid enables the use of broader cell widths compared with grid‐free CIGS samples and results in a reduced dead area.