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Acetamidinium Cation to Confer Ion Immobilization and Structure Stabilization of Organometal Halide Perovskite Toward Long Life and High‐Efficiency p‐i‐n Planar Solar Cell via Air‐Processable Method
Author(s) -
Hsiao Kai-Chi,
Jao Meng-Huan,
Tian Kuo-Yu,
Lin Ting-Han,
Tran Dinh-Phuc,
Liao Hsueh-Chung,
Hou Cheng-Hung,
Shyue Jing-Jong,
Wu Ming-Chung,
Su Wei-Fang
Publication year - 2020
Publication title -
solar rrl
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.544
H-Index - 37
ISSN - 2367-198X
DOI - 10.1002/solr.202000197
Subject(s) - halide , crystallization , energy conversion efficiency , materials science , solar cell , fabrication , perovskite (structure) , chemical engineering , ion , humidity , crystal (programming language) , perovskite solar cell , nanotechnology , chemistry , optoelectronics , inorganic chemistry , organic chemistry , medicine , alternative medicine , physics , pathology , engineering , thermodynamics , computer science , programming language
Ion migration in organometal halide perovskite solar cell (OHPSC) and crystal structure evolution of organometal halide perovskites (OHPVSKs) in air are considered as one of the critical factors for unstable performance and of the urgent issues for the reliability of OHPSCs. Herein, a novel cation of acetamidinium (Aa + ) with stronger coordinated bond with I − than methylammonium is induced into OHPVSK to stabilize its crystal structure. By incorporating Aa + ions into OHPVSKs, the power conversion efficiency (PCE) of OHPSC without an encapsulation can maintain higher than 75% of its initial PCE after a 200 h humidity (60–80% relative humidity (RH) in air) or a 24 h thermal stress test (85 °C in dry N 2 ). The Aa–MAPbI 3 device exhibits an outstanding efficiency of 20.68%, and over 80% of initial PCE is maintained after a 1300 h damp heat as encapsulated. This novel cation can be easily incorporated into OHPVSK via a hot casting process in air with a high environmental tolerance as compared with that from the conventional coating process, which suffers from sophisticated crystallization steps and a strict processing atmosphere. It extends processing windows for OHPVSK fabrication and provides a promising path toward mass production and further commercialization.