Open AccessFlexible substrates enabled highly integrated patterns with submicron precision toward intrinsically stretchable circuits
Author(s) -
Lv Wenkun,
Liu Zhaoxin,
Li Zheng,
Han Zhifei,
Yang Yongrui,
Li Qi,
Qiao Yali,
Song Yanlin
Publication year - 2022
Publication title -
smartmat
Language(s) - English
Resource type - Journals
ISSN - 2688-819X
DOI - 10.1002/smm2.1104
Subject(s) - materials science , fabrication , nanotechnology , substrate (aquarium) , stretchable electronics , realization (probability) , electrical conductor , elastomer , integrated circuit , optoelectronics , electronics , composite material , electrical engineering , medicine , oceanography , alternative medicine , statistics , mathematics , engineering , pathology , geology
Fabricating high integration density, high resolution, and intrinsically stretchable patterns by patterned technologies remain challenging. Template printing enabled high‐precision patterned fabrication at a facile operation. However, the pattern spacing constraint is the major limitation to high integration density. In this study, we develop an elastomer‐assisted strategy to improve the template printing process, which involves patterning on the prestrain elastic substrate. This strategy overcomes the spacing limitation and enables the realization of a centimeter‐scale pattern with submicron precision. Particularly, the integration density of fabricated intrinsically stretchable patterns can reach 1932 lines on a substrate of 0.5 cm 2 ; the assembly lines with a feature size of 880 nm and an interval of 955 nm. Furthermore, we demonstrate a facile approach for constructing silver nanoparticle/liquid metal alloy composite conductive patterns. The as‐prepared flexible electrodes can withstand up to 150% strain and a 2‐mm bend radius. This method provides new insights into template printing technology. Additionally, it opens a route for the simultaneous construction of functional patterned arrays with large scale, high integration density, and intrinsic stretchability, which will be useful for the integrated fabrication of various flexible electronic devices.