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Water Splitting: Covalent SO Bonding Enables Enhanced Photoelectrochemical Performance of Cu 2 S/Fe 2 O 3 Heterojunction for Water Splitting (Small 30/2021)
Author(s) -
Zhang Yan,
Huang Yuan,
Zhu ShiShi,
Liu YuanYuan,
Zhang Xing,
Wang JianJun,
Braun Artur
Publication year - 2021
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.202170154
Subject(s) - water splitting , heterojunction , covalent bond , materials science , charge (physics) , recombination , optoelectronics , photoelectrochemistry , nanotechnology , chemistry , physics , photocatalysis , catalysis , electrochemistry , electrode , biochemistry , quantum mechanics , gene , organic chemistry
In article number 2100320, Jian‐Jun Wang, Artur Braun, and co‐workers demonstrate that the formation of covalent S—O bonds between Cu 2 S and Fe 2 O 3 can significantly improve the performance of the Cu 2 S/Fe 2 O 3 heterojunction photoelectrode for photoelectrochemical water splitting owning to the enhanced charge separation and transfer, and reduced charge recombination rate.