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Binary and Ternary Colloidal Cu‐Sn‐Te Nanocrystals for Thermoelectric Thin Films
Author(s) -
Yin Deqiang,
Dun Chaochao,
Zhang Huisheng,
Fu Zheng,
Gao Xiang,
Wang Xianliang,
Singh David J.,
Carroll David L.,
Liu Yang,
Swihart Mark T.
Publication year - 2021
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.202006729
Subject(s) - materials science , ternary operation , telluride , chalcogenide , copper , thermoelectric effect , nanocrystal , thermoelectric materials , tellurium , nanorod , nanotechnology , bismuth telluride , crystal growth , chemical engineering , crystallography , metallurgy , chemistry , composite material , thermal conductivity , physics , computer science , engineering , thermodynamics , programming language
Abstract Recent advances in copper chalcogenide‐based nanocrystals (NCs), copper sulfide, and copper selenide derived nanostructures, have drawn considerable attention. However, reports of crystal phase and shape engineering of binary or ternary copper telluride NCs remain rare. Here, a colloidal hot‐injection approach for producing binary copper/tin telluride, and ternary copper tin telluride NCs with controllable compositions, crystal structures, and morphologies is reported. The crystal phase and growth behavior of these tellurides are systematically studied from both experimental and theoretical perspectives. The morphology of Cu 1.29 Te NCs is modified from 1D nanorods with different aspect ratios to 2D nanosheets and 3D nanocubes, by controlling the preferential growth of specific crystalline facets. A controllable phase transition from Cu 1.29 Te to Cu 1.43 Te NCs is also demonstrated. The latter can be further converted into Cu 2 SnTe 3 and SnTe through Sn incorporation. Temperature dependent thermoelectric properties of metal (Cu and Sn) telluride nanostructure thin films are also studied, including Cu 1.29 Te, Cu 1.43 Te, Cu 2 SnTe 3 , and SnTe. Cu 2 SnTe 3 is a low carrier density semimetal with compensating electron and hole Fermi surface pockets. The engineering of crystal phase and morphology control of colloidal copper tin telluride NCs opens a path to explore and design new classes of copper telluride‐based nanomaterials for thermoelectrics and other applications.