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3D Microsupercapacitors: 3D Interdigitated Microsupercapacitors with Record Areal Cell Capacitance (Small 27/2019)
Author(s) -
Ferris Anaïs,
Bourrier David,
Garbarino Sébastien,
Guay Daniel,
Pech David
Publication year - 2019
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201970143
Subject(s) - materials science , capacitance , supercapacitor , microscale chemistry , wafer , footprint , nanotechnology , electrode , electronics , optoelectronics , solid state , energy storage , engineering physics , electrical engineering , engineering , paleontology , chemistry , mathematics education , mathematics , biology , power (physics) , physics , quantum mechanics
Microscale energy storage for embedded electronics remains a major challenge at the dawn of the Internet of Things. In article number 1901224, David Pech, Daniel Guay, and co‐workers describe the integration of 3D pseudocapacitive electrodes on a silicon wafer to realize all‐solid‐state interdigitated microsupercapacitors with a record cell capacitance of 812 mF cm −2 per footprint area.
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