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Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
Author(s) -
Wang Nan,
Samani Majid Kabiri,
Li Hu,
Dong Lan,
Zhang Zhongwei,
Su Peng,
Chen Shujing,
Chen Jie,
Huang Shirong,
Yuan Guangjie,
Xu Xiangfan,
Li Baowen,
Leifer Klaus,
Ye Lilei,
Liu Johan
Publication year - 2018
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201801346
Subject(s) - materials science , graphene , stacking , pyrolytic carbon , thermal conductivity , scattering , phonon , phonon scattering , graphite , condensed matter physics , optoelectronics , nanotechnology , composite material , optics , chemical engineering , nuclear magnetic resonance , physics , pyrolysis , engineering
Due to substantial phonon scattering induced by various structural defects, the in‐plane thermal conductivity ( K ) of graphene films (GFs) is still inferior to the commercial pyrolytic graphite sheet (PGS). Here, the problem is solved by engineering the structures of GFs in the aspects of grain size, film alignment, and thickness, and interlayer binding energy. The maximum K of GFs reaches to 3200 W m −1 K −1 and outperforms PGS by 60%. The superior K of GFs is strongly related to its large and intact grains, which are over four times larger than the best PGS. The large smooth features about 11 µm and good layer alignment of GFs also benefit on reducing phonon scattering induced by wrinkles/defects. In addition, the presence of substantial turbostratic‐stacking graphene is found up to 37% in thin GFs. The lacking of order in turbostratic‐stacking graphene leads to very weak interlayer binding energy, which can significantly decrease the phonon interfacial scattering. The GFs also demonstrate excellent flexibility and high tensile strength, which is about three times higher than PGS. Therefore, GFs with optimized structures and properties show great potentials in thermal management of form‐factor‐driven electronics and other high‐power‐driven systems.