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Metallic Contact between MoS 2 and Ni via Au Nanoglue
Author(s) -
Shi Xinying,
Posysaev Sergei,
Huttula Marko,
Pankratov Vladimir,
Hoszowska Joanna,
Dousse JeanClaude,
Zeeshan Faisal,
Niu Yuran,
Zakharov Alexei,
Li Taohai,
Miroshnichenko Olga,
Zhang Meng,
Wang Xiao,
Huang Zhongjia,
Saukko Sami,
González Diego López,
van Dijken Sebastiaan,
Alatalo Matti,
Cao Wei
Publication year - 2018
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201704526
Subject(s) - materials science , photoemission electron microscopy , heterojunction , semiconductor , nanocomposite , metal , electrical contacts , synchrotron radiation , nanotechnology , nanoparticle , transition metal , nickel , optoelectronics , electron microscope , optics , metallurgy , chemistry , biochemistry , physics , catalysis
Abstract A critical factor for electronics based on inorganic layered crystals stems from the electrical contact mode between the semiconducting crystals and the metal counterparts in the electric circuit. Here, a materials tailoring strategy via nanocomposite decoration is carried out to reach metallic contact between MoS 2 matrix and transition metal nanoparticles. Nickel nanoparticles (NiNPs) are successfully joined to the sides of a layered MoS 2 crystal through gold nanobuffers, forming semiconducting and magnetic NiNPs@MoS 2 complexes. The intrinsic semiconducting property of MoS 2 remains unchanged, and it can be lowered to only few layers. Chemical bonding of the Ni to the MoS 2 host is verified by synchrotron radiation based photoemission electron microscopy, and further proved by first‐principles calculations. Following the system's band alignment, new electron migration channels between metal and the semiconducting side contribute to the metallic contact mechanism, while semiconductor–metal heterojunctions enhance the photocatalytic ability.