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Flexible Electronics: Deterministic Integration of Out‐of‐Plane Sensor Arrays for Flexible Electronic Applications (Small 37/2016)
Author(s) -
Hussain Aftab M.,
Hussain Muhammad M.
Publication year - 2016
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201670189
Subject(s) - fabrication , electronics , materials science , flexible electronics , nanotechnology , polymer , process (computing) , printed electronics , optoelectronics , electrical engineering , computer science , engineering , composite material , medicine , alternative medicine , pathology , operating system
On page 5141, A. M. Hussain and M. M. Hussain report a process for fabricating electronics and sensor arrays on the opposite sides of the same flexible polymer, which can lead to the development of high resolution brain machine interfaces (BMI). The fabrication is done monolithically in a single process‐flow, following which the polymer is released to obtain a flexible device with sensors on one side and control electronics on another, interconnected using through polymer vias (TPVs).