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Progress on Electronic and Optoelectronic Devices of 2D Layered Semiconducting Materials
Author(s) -
Wang Feng,
Wang Zhenxing,
Jiang Chao,
Yin Lei,
Cheng Ruiqing,
Zhan Xueying,
Xu Kai,
Wang Fengmei,
Zhang Yu,
He Jun
Publication year - 2017
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201604298
Subject(s) - materials science , heterojunction , nanotechnology , semiconductor , optoelectronics , flexibility (engineering) , dielectric , electronics , engineering physics , doping , dangling bond , electronic materials , silicon , electrical engineering , statistics , mathematics , engineering
2D layered semiconducting materials (2DLSMs) represent the thinnest semiconductors, holding many novel properties, such as the absence of surface dangling bonds, sizable band gaps, high flexibility, and ability of artificial assembly. With the prospect of bringing revolutionary opportunities for electronic and optoelectronic applications, 2DLSMs have prospered over the past twelve years. From materials preparation and property exploration to device applications, 2DLSMs have been extensively investigated and have achieved great progress. However, there are still great challenges for high‐performance devices. In this review, we provide a brief overview on the recent breakthroughs in device optimization based on 2DLSMs, particularly focussing on three aspects: device configurations, basic properties of channel materials, and heterostructures. The effects from device configurations, i.e., electrical contacts, dielectric layers, channel length, and substrates, are discussed. After that, the affect of the basic properties of 2DLSMs on device performance is summarized, including crystal defects, crystal symmetry, doping, and thickness. Finally, we focus on heterostructures based on 2DLSMs. Through this review, we try to provide a guide to improve electronic and optoelectronic devices of 2DLSMs for achieving practical device applications in the future.