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Metallic Nanowire‐Based Transparent Electrodes for Next Generation Flexible Devices: a Review
Author(s) -
Sannicolo Thomas,
Lagrange Mélanie,
Cabos Anthony,
Celle Caroline,
Simonato JeanPierre,
Bellet Daniel
Publication year - 2016
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201602581
Subject(s) - materials science , nanowire , nanotechnology , indium tin oxide , nanomaterials , flexibility (engineering) , transparency (behavior) , transparent conducting film , thin film , engineering physics , computer science , statistics , mathematics , computer security , engineering
Transparent electrodes attract intense attention in many technological fields, including optoelectronic devices, transparent film heaters and electromagnetic applications. New generation transparent electrodes are expected to have three main physical properties: high electrical conductivity, high transparency and mechanical flexibility. The most efficient and widely used transparent conducting material is currently indium tin oxide (ITO). However the scarcity of indium associated with ITO's lack of flexibility and the relatively high manufacturing costs have a prompted search into alternative materials. With their outstanding physical properties, metallic nanowire (MNW)‐based percolating networks appear to be one of the most promising alternatives to ITO. They also have several other advantages, such as solution‐based processing, and are compatible with large area deposition techniques. Estimations of cost of the technology are lower, in particular thanks to the small quantities of nanomaterials needed to reach industrial performance criteria. The present review investigates recent progress on the main applications reported for MNW networks of any sort (silver, copper, gold, core‐shell nanowires) and points out some of the most impressive outcomes. Insights into processing MNW into high‐performance transparent conducting thin films are also discussed according to each specific application. Finally, strategies for improving both their stability and integration into real devices are presented.