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Highly Manufacturable Deep (Sub‐Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego‐Like Silicon Electronics
Author(s) -
Ghoneim Mohamed Tarek,
Hussain Muhammad Mustafa
Publication year - 2017
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201601801
Subject(s) - etching (microfabrication) , materials science , deep reactive ion etching , electronics , silicon , reactive ion etching , nanotechnology , engraving , millimeter , aspect ratio (aeronautics) , optoelectronics , engineering , electrical engineering , optics , composite material , physics , layer (electronics)
A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego‐like silicon electronics formation enabling free‐form (physically flexible, stretchable, and reconfigurable) electronic systems.