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Deterministic Integration of Out‐of‐Plane Sensor Arrays for Flexible Electronic Applications
Author(s) -
Hussain Aftab M.,
Hussain Muhammad M.
Publication year - 2016
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201600952
Subject(s) - polyimide , materials science , electrode , electrical impedance , optoelectronics , copper , electronic engineering , electrical engineering , nanotechnology , engineering , physics , layer (electronics) , quantum mechanics , metallurgy
A design strategy for fully flexible electrode arrays with out‐of‐plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz ( Z ≈ 20 Ω, θ ≈ 0°).