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DNA Nanotechnology: Overcoming the Coupling Dilemma in DNA‐Programmable Nanoparticle Assemblies by “Ag + Soldering” (Small 19/2015)
Author(s) -
Wang Huiqiao,
Li Yulin,
Liu Miao,
Gong Ming,
Deng Zhaoxiang
Publication year - 2015
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201570107
Subject(s) - nanotechnology , nanoparticle , materials science , coupling (piping) , dna , plasmon , colloidal gold , dna nanotechnology , soldering , chemistry , optoelectronics , composite material , biochemistry
Strong interparticle coupling is important to facilitate charge and energy transfer. Despite great successes in DNA nanotechnology, the weak coupling of DNA‐assembled nanoparticles is often overlooked. On page 2247, Z. Deng and co‐workers describe DNA‐programmable Ag + soldering to address this challenge. Firstly, monovalent (with minimized steric effects) DNA‐conjugated gold nanoparticles are assembled into desired structures (e.g., a dimer), and then Ag + ions are introduced to solder nanoparticles positioned in close proximity to realize strong plasmon coupling.