Low Temperature Sintering Cu 6 Sn 5  Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections | Zendy

Zhong Ying | Zendy; An Rong | Zendy; Wang Chunqing | Zendy; Zheng Zhen | Zendy; Liu ZhiQuan | Zendy; Liu ChinHung | Zendy; Li CaiFu | Zendy; Kim Tae Kyoung | Zendy; Jin Sungho | Zendy

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Low Temperature Sintering Cu 6 Sn 5 Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections

Author(s) -

Zhong Ying,

An Rong,

Wang Chunqing,

Zheng Zhen,

Liu ZhiQuan,

Liu ChinHung,

Li CaiFu,

Kim Tae Kyoung,

Jin Sungho

Publication year - 2015

Publication title -

small

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 3.785

H-Index - 236

eISSN - 1613-6829

pISSN - 1613-6810

DOI - 10.1002/smll.201500896

Subject(s) - materials science , superplasticity , sintering , intermetallic , interconnection , melting point , nanoparticle , melting temperature , composite material , brittleness , metallurgy , optoelectronics , nanotechnology , microstructure , alloy , computer network , computer science

Brittle intermetallics such as Cu 6 Sn 5 can be transformed into low cost, nonbrittle, superplastic and high temperature‐resistant interconnection materials by sintering at temperatures more than 200 °C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore‐free with nanograins, and the interface is super‐uniform.

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