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Low Temperature Sintering Cu 6 Sn 5 Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections
Author(s) -
Zhong Ying,
An Rong,
Wang Chunqing,
Zheng Zhen,
Liu ZhiQuan,
Liu ChinHung,
Li CaiFu,
Kim Tae Kyoung,
Jin Sungho
Publication year - 2015
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201500896
Subject(s) - materials science , superplasticity , sintering , intermetallic , interconnection , melting point , nanoparticle , melting temperature , composite material , brittleness , metallurgy , optoelectronics , nanotechnology , microstructure , alloy , computer network , computer science
Brittle intermetallics such as Cu 6 Sn 5 can be transformed into low cost, nonbrittle, superplastic and high temperature‐resistant interconnection materials by sintering at temperatures more than 200 °C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore‐free with nanograins, and the interface is super‐uniform.