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Overcoming the Coupling Dilemma in DNA‐Programmable Nanoparticle Assemblies by “Ag + Soldering”
Author(s) -
Wang Huiqiao,
Li Yulin,
Liu Miao,
Gong Ming,
Deng Zhaoxiang
Publication year - 2015
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201403108
Subject(s) - nanotechnology , computer science , nanoparticle , coupling (piping) , service (business) , materials science , metallurgy , economy , economics
Strong coupling between nanoparticles is critical for facilitating charge and energy transfers. Despite the great success of DNA‐programmable nanoparticle assemblies, the very weak interparticle coupling represents a key barrier to various applications. Here, an extremely simple, fast, and highly efficient process combining DNA‐programming and molecular/ionic bonding is developed to address this challenge, which exhibits a seamless fusion with DNA nanotechnology.