Overcoming the Coupling Dilemma in DNA‐Programmable Nanoparticle Assemblies by “Ag +  Soldering” | Zendy

Wang Huiqiao | Zendy; Li Yulin | Zendy; Liu Miao | Zendy; Gong Ming | Zendy; Deng Zhaoxiang | Zendy

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Overcoming the Coupling Dilemma in DNA‐Programmable Nanoparticle Assemblies by “Ag + Soldering”

Author(s) -

Wang Huiqiao,

Li Yulin,

Liu Miao,

Gong Ming,

Deng Zhaoxiang

Publication year - 2015

Publication title -

small

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 3.785

H-Index - 236

eISSN - 1613-6829

pISSN - 1613-6810

DOI - 10.1002/smll.201403108

Subject(s) - nanotechnology , computer science , nanoparticle , coupling (piping) , service (business) , materials science , metallurgy , economy , economics

Strong coupling between nanoparticles is critical for facilitating charge and energy transfers. Despite the great success of DNA‐programmable nanoparticle assemblies, the very weak interparticle coupling represents a key barrier to various applications. Here, an extremely simple, fast, and highly efficient process combining DNA‐programming and molecular/ionic bonding is developed to address this challenge, which exhibits a seamless fusion with DNA nanotechnology.

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