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Toughening Thin‐Film Structures with Ceramic‐Like Amorphous Silicon Carbide Films
Author(s) -
Matsuda Yusuke,
Ryu Ill,
King Sean W.,
Bielefeld Jeff,
Dauskardt Reinhold H.
Publication year - 2014
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201300130
Subject(s) - materials science , toughening , ceramic , thin film , amorphous solid , nanoscopic scale , silicon carbide , composite material , thermal stability , nanotechnology , amorphous silicon , carbon film , chemical engineering , crystalline silicon , toughness , layer (electronics) , chemistry , engineering , organic chemistry
A significant improvement of adhesion in thin‐film structures is demonstrated using embedded ceramic‐like amorphous silicon carbide films (a‐SiC:H films). a‐SiC:H films exhibit plasticity at the nanoscale and outstanding chemical and thermal stability unlike most materials. The multi‐functionality and the ease of processing of the films have potential to offer a new toughening strategy for reliability of nanoscale device structures.