Toughening Thin‐Film Structures with Ceramic‐Like Amorphous Silicon Carbide Films | Zendy

Matsuda Yusuke | Zendy; Ryu Ill | Zendy; King Sean W. | Zendy; Bielefeld Jeff | Zendy; Dauskardt Reinhold H. | Zendy

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Toughening Thin‐Film Structures with Ceramic‐Like Amorphous Silicon Carbide Films

Author(s) -

Matsuda Yusuke,

Ryu Ill,

King Sean W.,

Bielefeld Jeff,

Dauskardt Reinhold H.

Publication year - 2014

Publication title -

small

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 3.785

H-Index - 236

eISSN - 1613-6829

pISSN - 1613-6810

DOI - 10.1002/smll.201300130

Subject(s) - materials science , toughening , ceramic , thin film , amorphous solid , nanoscopic scale , silicon carbide , composite material , thermal stability , nanotechnology , amorphous silicon , carbon film , chemical engineering , crystalline silicon , toughness , layer (electronics) , chemistry , engineering , organic chemistry

A significant improvement of adhesion in thin‐film structures is demonstrated using embedded ceramic‐like amorphous silicon carbide films (a‐SiC:H films). a‐SiC:H films exhibit plasticity at the nanoscale and outstanding chemical and thermal stability unlike most materials. The multi‐functionality and the ease of processing of the films have potential to offer a new toughening strategy for reliability of nanoscale device structures.

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