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Fatigue‐Free, Electrically Reliable Copper Electrode with Nanohole Array
Author(s) -
Kim ByoungJoon,
Cho Yigil,
Jung MinSuk,
Shin HaeASeul,
Moon MyoungWoon,
Han Heung Nam,
Nam Ki Tae,
Joo YoungChang,
Choi InSuk
Publication year - 2012
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201200674
Subject(s) - materials science , electrode , bending , fabrication , composite material , reliability (semiconductor) , copper , optoelectronics , nanotechnology , metallurgy , medicine , power (physics) , chemistry , alternative medicine , physics , quantum mechanics , pathology
Design and fabrication of reliable electrodes is one of the most important challenges in flexible devices, which undergo repeated deformation. In conventional approaches, mechanical and electrical properties of continuous metal films degrade gradually because of the fatigue damage. The designed incorporation of nanoholes into Cu electrodes can enhance the reliability. In this study, the electrode shows extremely low electrical resistance change during bending fatigue because the nanoholes suppress crack initiation by preventing protrusion formation and damage propagation by crack tip blunting. This concept provides a key guideline for developing fatigue‐free flexible electrodes.