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Carbon‐Nanotube Through‐Silicon Via Interconnects for Three‐Dimensional Integration
Author(s) -
Wang Teng,
Jeppson Kejll,
Ye Lilei,
Liu Johan
Publication year - 2011
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201100615
Subject(s) - microscale chemistry , carbon nanotube , interconnection , materials science , silicon , nanotechnology , process (computing) , electrical contacts , nanotube , computer science , optoelectronics , telecommunications , mathematics education , mathematics , operating system
Interconnection of carbon‐nanotube (CNT)‐filled through‐silicon vias is demonstrated through an easy‐to‐implement process based on mechanical fastening. Direct CNT‐to‐CNT and CNT‐to‐Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10 −3 Ω cm 2 and 4.5 × 10 −4 Ω cm 2 , respectively.