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An Effective Lift‐Off Method for Patterning High‐Density Gold Interconnects on an Elastomeric Substrate
Author(s) -
Guo Liang,
DeWeerth Stephen P.
Publication year - 2010
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.201001456
Subject(s) - conformable matrix , elastomer , lift (data mining) , substrate (aquarium) , fabrication , materials science , nanotechnology , stretchable electronics , electronics , high resolution , computer science , optoelectronics , electrical engineering , composite material , engineering , geology , data mining , medicine , oceanography , alternative medicine , remote sensing , pathology
High‐resolution, high‐density gold interconnects are effectively patterned on an elastomeric substrate. A 3 cm cable of ten gold wires with 10 μm width and 20 μm pitch is achieved, successfully demonstrating density increases of more than one order of magnitude from previously established work. Many applications in the fields of stretchable electronics and conformable neural interfaces will benefit from these fabrication developments.