Premium
Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems
Author(s) -
Cui Qingzhou,
Gao Fan,
Mukherjee Subhadeep,
Gu Zhiyong
Publication year - 2009
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200801551
Subject(s) - nanoelectronics , nanotechnology , carbon nanotube , materials science , interconnection , nanowire , nanomaterials , nanoscopic scale , computer science , telecommunications
Interconnect formation is critical for the assembly and integration of nanocomponents to enable nanoelectronics‐ and nanosystems‐related applications. Recent progress on joining and interconnect formation of key nanomaterials, especially nanowires and carbon nanotubes, into functional circuits and/or prototype devices is reviewed. The nanosoldering technique through nanoscale lead‐free solders is discussed in more detail in this Review. Various strategies of fabricating lead‐free nanosolders and the utilization of the nanosoldering technique to form functional solder joints are reviewed, and related challenges facing the nanosoldering technique are discussed. A perspective is given for using lead‐free nanosolders and the nanosoldering technique for the construction of complex and/or hybrid nanoelectronics and nanosystems.