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Large‐Area Dual‐Scale Metal Transfer by Adhesive Force
Author(s) -
Kwak Moon Kyu,
Kim Taeil,
Kim Pilnam,
Lee Hong H.,
Suh Kahp Y.
Publication year - 2009
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200801262
Subject(s) - adhesive , materials science , metal , dual (grammatical number) , polymer , composite material , layer (electronics) , scale (ratio) , contact area , mold , transfer (computing) , nanotechnology , metallurgy , computer science , art , physics , literature , quantum mechanics , parallel computing
A dual‐scale metal transfer technique is presented to generate metal patterns with two different length scales from a single master. An adhesive polymer layer is brought in contact with the metal‐coated surface in two sequential steps to transfer metal layers from both ridges and valleys of the mold aided by the difference in adhesive force (see image).