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A Combined Top‐down and Bottom‐up approach for Precise Placement of Metal Nanoparticles on Silicon
Author(s) -
Choi W. K.,
Liew T. H.,
Chew H. G.,
Zheng F.,
Thompson C. V.,
Wang Y.,
Hong M. H.,
Wang X. D.,
Li L.,
Yun J.
Publication year - 2008
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200800395
Subject(s) - silicon , top down and bottom up design , nanoparticle , metal , nanotechnology , materials science , computer science , metallurgy , programming language
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