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Thin Film Stress Driven Self‐Folding of Microstructured Containers
Author(s) -
Leong Timothy G.,
Benson Bryan R.,
Call Emma K.,
Gracias David H.
Publication year - 2008
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200800280
Subject(s) - materials science , folding (dsp implementation) , stress (linguistics) , nanotechnology , thin film , composite material , mechanical engineering , engineering , philosophy , linguistics
Tiny boxes : A highly parallel, low‐temperature process allows the self‐assembly of hollow, cubic microcontainers with patterned faces that can encapsulate objects within. The process is based on the self‐folding of lithographically patterned cruciforms and exploits stress inherent in thermally evaporated thin films to drive the assembly of the microstructures, which are on the order of 50–500 µm. The assembly occurs in water at 40–60 °C.