Premium
Polyethylene Glycol as a Novel Resist and Sacrificial Material for Generating Positive and Negative Nanostructures
Author(s) -
Sanedrin Raymond G.,
Huang Ling,
Jang JaeWon,
Kakkassery Joseph,
Mirkin Chad A.
Publication year - 2008
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200701089
Subject(s) - resist , ethylene glycol , nanostructure , nanotechnology , nanoscopic scale , materials science , polyethylene glycol , solid state , copolymer , chemistry , polymer , organic chemistry , composite material , physics , engineering physics , layer (electronics)
One material for two purposes : Poly(ethylene glycol) is used as a novel etch resist to generate both raised and recessed nanoscale solid‐state structures (see image). This novel resist is inexpensive, easy to use, and affords sub‐100‐nm resolution.