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Nanostructured Copper Interfaces for Enhanced Boiling
Author(s) -
Li Chen,
Wang Zuankai,
Wang PeiI,
Peles Yoav,
Koratkar Nikhil,
Peterson G. P.
Publication year - 2008
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200700991
Subject(s) - microscale chemistry , nucleation , boiling , superheating , bubble , materials science , copper , nanotechnology , nanopore , chemical engineering , computer science , thermodynamics , physics , metallurgy , engineering , operating system , mathematics education , mathematics
On the boil: Nanostructured Cu interfaces display enhanced boiling performance at low superheated temperatures compared to untreated Cu, caused by a large increase in the density of active bubble nucleation sites. The enhancement is caused by nanobubbles, which percolate through the interconnected network of nanopores and enable stable nucleation of bubbles at microscale cavities (defects) on the film surface (see picture).