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A Combined Top‐Down and Bottom‐Up Approach for Precise Placement of Metal Nanoparticles on Silicon
Author(s) -
Choi Wee Kiong,
Liew Tze Haw,
Chew Han Guan,
Zheng Fei,
Thompson Carl V.,
Wang Yang,
Hong Ming Hui,
Wang Xiao Dong,
Li Li,
Yun Jia
Publication year - 2008
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200700728
Subject(s) - materials science , silicon , nanoparticle , fabrication , annealing (glass) , nanotechnology , lithography , metal , optoelectronics , composite material , metallurgy , medicine , alternative medicine , pathology
Bottoms up! The techniques of laser interference lithography and coarsening of Au dots are combined and used to place Au nanoparticles in inverted pyramids at precise locations on silicon surfaces. The fabrication process is robust against variations in the topographic factor, for example, pit‐to‐mesa width ratio. Excellent tunability of the diameter of the nanoparticles is achieved by a careful manipulation of Au thickness and annealing condition.