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Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures
Author(s) -
Hagberg Erik C.,
Scott J. Campbell,
Shaw Justine A.,
von Werne Timothy A.,
Maegerlein Janet A.,
Carter Kenneth R.
Publication year - 2007
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200700343
Subject(s) - materials science , fabrication , molding (decorative) , nanoscopic scale , layer (electronics) , plating (geology) , copper , nanotechnology , substrate (aquarium) , electrical conductor , metal , polymer , mold , copper plating , composite material , metallurgy , electroplating , geophysics , geology , medicine , oceanography , alternative medicine , pathology
Plating up : A new fabrication technique for the creation of patterns of metal or circuitization on a substrate is demonstrated. Nanocontact molding allows for the reproduction of features ranging from millimeter to subnanometer features into a functional polymer layer (see image). Through the facile electroless plating of metallic copper directly from the surface of functional polymeric patterns, conductive metal features can be constructed at nanoscale dimensions.