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Bond–Detach Lithography: A Method for Micro/Nanolithography by Precision PDMS Patterning
Author(s) -
Thangawng Abel L.,
Swartz Melody A.,
Glucksberg Matthew R.,
Ruoff Rodney S.
Publication year - 2007
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200500418
Subject(s) - microfabrication , lithography , nanolithography , pdms stamp , dip pen nanolithography , materials science , nanotechnology , soft lithography , resist , nanoscopic scale , mold , next generation lithography , fabrication , stencil lithography , x ray lithography , optoelectronics , electron beam lithography , layer (electronics) , composite material , medicine , alternative medicine , pathology
We have discovered a micro/nanopatterning technique based on the patterning of a PDMS membrane/film, which involves bonding a PDMS structure/stamp (that has the desired patterns) to a PDMS film. The technique, which we call “bond–detach lithography”, was demonstrated (in conjunction with other microfabrication techniques) by transferring several micro‐ and nanoscale patterns onto a variety of substrates. Bond–detach lithography is a parallel process technique in which a master mold can be used many times, and is particularly simple and inexpensive.