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Self‐Assembly of Copper Micro/Nanoscale Parallel Wires by Electrodeposition on a Silicon Substrate
Author(s) -
Zhang Mingzhe,
Zuo Guihong,
Zong Zhaocun,
Cheng Haiyong,
He Zhi,
Yang Cunming,
Zou Guangtian
Publication year - 2006
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200500338
Subject(s) - copper , materials science , substrate (aquarium) , nanoscopic scale , silicon , nanotechnology , layer (electronics) , electrolyte , copper oxide , oxide , self assembly , chemical engineering , optoelectronics , metallurgy , electrode , chemistry , oceanography , geology , engineering
Arrays of straight copper wires can be deposited onto a silica layer (see image) by controlling the concentration of the CuSO 4 electrolyte used. The copper wires are shown to contain nanograins of copper oxide, a consequence of the mechanism of their preparation. Wires with widths varying from 80 to 1200 nm suggest promise for applications in, amongst other realms, magnetic storage devices.