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Reflow and Electrical Characteristics of Nanoscale Solder
Author(s) -
Gu Zhiyong,
Ye Hongke,
Smirnova Diana,
Small David,
Gracias David H.
Publication year - 2006
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200500296
Subject(s) - soldering , materials science , intermetallic , reflow soldering , nanoscopic scale , metallurgy , ohmic contact , corrosion , electromigration , composite material , nanotechnology , layer (electronics) , alloy
Soldering nanojoints : Nanowires with a diameter range of 30–200 nm were patterned with solder segments, and the reflow of the solder on these wires was investigated (see Figure). Low‐resistance ohmic contacts were observed across solder joints after reflow. Corrosion, oxidation, and intermetallic diffusion play a crucial role in solder reflow and joint formation at the nanoscale.